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Please use this identifier to cite or link to this item: http://ir.ncue.edu.tw/ir/handle/987654321/10907

Title: Optical and Thermal Analysis for a Modified Flip-Chip Light Emitted Diode
Authors: Wang, C. C.;Yang, W. R.;Chen, Jin-Jia;Shih, W. W.;Wang, I. J.;Guo, T. Y.;Huang, K. L.
Contributors: 電機工程學系
Date: 2008-10
Issue Date: 2012-06-04T09:13:56Z
Publisher: AOE
Abstract: The proposed design for modified flip-chip LED (Light Emitting Diode) has average coupling efficiency of 49.6% for misalignment of 0.4---3 mm. The designed ambient environment also improves the thermal efficiency by factor of 1.6.
Relation: Asia Optical Fiber Communication & Optoelectronic Exposition & Conference (AOE) 2008, Shanghai, China, October 30-November 2, 2008
Appears in Collections:[電機工程學系] 會議論文

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