English  |  正體中文  |  简体中文  |  Items with full text/Total items : 6487/11649
Visitors : 28590087      Online Users : 282
RC Version 3.2 © Powered By DSPACE, MIT. Enhanced by NTU Library IR team.
Scope Adv. Search

Please use this identifier to cite or link to this item: http://ir.ncue.edu.tw/ir/handle/987654321/11364

Title: Self-assembly of PZT Actuators for Micro Pumps with High Process Repeatability
Authors: Fang, Jiandong;Wang, Kerwin;B�hringer, Karl F.
Contributors: 機電工程學系
Date: 2006-08
Issue Date: 2012-06-06T01:41:26Z
Publisher: IEEE
Abstract: In this paper, we report a novel capillary-drivenself-assembly technique which proceeds in an air environment and demonstrate it by assembling square piezoelectric transducer (PZT) actuators for 28 diffuser valve micropumps on a 4-inch pyrex/silicon substrate: on the substrate, binding sites are wells of 24 m in depth and the only hydrophilic areas; on the bonding face of the PZT actuator, the central hydrophilic area is a square
identical in size to the binding site, and the rim is hydrophobic; acrylate-based adhesive liquid is dispensed across the substrate and wets only the binding sites; the hydrophilic areas on the introduced PZT actuators self-align with the binding sites to minimize interfacial energies by capillary forces from the adhesive droplets; the aligned PZT actuators are pressed to contact the gold coated substrate by their rims and the adhesive is polymerized by heating to 85 C for half an hour, so permanent mechanical and electrical connections are established, respectively, at the center and rim of each PZT actuator. These pumps perform with high uniformity, which is indicated by a small standard deviation of their resonant
frequencies to pump ethanol: the average resonant frequency is 6.99 kHz and the standard deviation is 0.1 kHz. Compared with the conventional bonding process with highly viscous silver epoxy, this assembly method has several major advantages: highly accurate placement with self-alignment, controllable adhesive thickness, tilt free bonding, low process temperature and high process repeatability.
Relation: IEEE Journal of Microelectromechanical Systems, 15(4):871-878
Appears in Collections:[機電工程學系] 期刊論文

Files in This Item:

File SizeFormat

All items in NCUEIR are protected by copyright, with all rights reserved.


DSpace Software Copyright © 2002-2004  MIT &  Hewlett-Packard  /   Enhanced by   NTU Library IR team Copyright ©   - Feedback