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Please use this identifier to cite or link to this item: http://ir.ncue.edu.tw/ir/handle/987654321/11384

Title: Template Based High Packing Density Assembly for Microchip Solid State Cooling Application
Authors: Wang, Kerwin;Baskaran, Rajashree;Bohringer, Karl F.
Contributors: 機電工程學系
Date: 2006-04
Issue Date: 2012-06-06T01:43:14Z
Abstract: 100% dry assembly using shape matching and van der Waals attraction for parts transfer has been performed to achieve high density parts
packing (up to 92%) of thermoelectric cooling components. The feasibility of this approach has been examined for component sizes across a range of 130-800μm.
Relation: 3rd Annual Conference on Foundations of Nanoscience: Selfassembled Architectures and Devices (FNANO)
Appears in Collections:[機電工程學系] 會議論文

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