National Changhua University of Education Institutional Repository : Item 987654321/11384
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题名: Template Based High Packing Density Assembly for Microchip Solid State Cooling Application
作者: Wang, Kerwin;Baskaran, Rajashree;Bohringer, Karl F.
贡献者: 機電工程學系
日期: 2006-04
上传时间: 2012-06-06T01:43:14Z
摘要: 100% dry assembly using shape matching and van der Waals attraction for parts transfer has been performed to achieve high density parts
packing (up to 92%) of thermoelectric cooling components. The feasibility of this approach has been examined for component sizes across a range of 130-800μm.
關聯: 3rd Annual Conference on Foundations of Nanoscience: Selfassembled Architectures and Devices (FNANO)
显示于类别:[機電工程學系] 會議論文


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