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Please use this identifier to cite or link to this item:
http://ir.ncue.edu.tw/ir/handle/987654321/11388
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| Title: | Binding Site Design for The Micro Conductive Bead Assembly in Flip Chip Bonding |
| Authors: | Wang, Kerwin;Cheng, Chih-Hung |
| Contributors: | 機電工程學系 |
| Keywords: | Micro bead;Assembly |
| Date: | 2008-06
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| Issue Date: | 2012-06-06T01:43:19Z
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| Publisher: | National Cheng Kung University |
| Abstract: | This paper presents a high-density assembly technology and design rules of micro-conductive-bead (4-10μm) assembly. The technology uses photoresist as a non-conductive binding adhesive for beads binding. With resolution quality limited only by photolithography, the method can significantly decrease the bonding pad size of up-to-date circuit chips and PCB boards, thus, it can lead to an increased interconnection density and a reduction in cost. Due to the randomized nature of the bead distribution on bonding pads in the process, we also develop a MATLBR based design tool to provide a guideline for the quality control of the assembly process. |
| Relation: | The 4th Asia Pacific Conference on Transducers and Micro/Nano Technologies, National Cheng Kung University, June 22-25, 2008 |
| Appears in Collections: | [機電工程學系] 會議論文
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Files in This Item:
| File |
Size | Format | |
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| 2050101316001.pdf | 75Kb | Adobe PDF | 520 | View/Open |
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