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NCUEIR > College of Engineering > Department of Mechatronics Engineering > Proceedings > Item 987654321/11388

Please use this identifier to cite or link to this item: http://ir.ncue.edu.tw/ir/handle/987654321/11388

Title:	Binding Site Design for The Micro Conductive Bead Assembly in Flip Chip Bonding
Authors:	Wang, Kerwin;Cheng, Chih-Hung
Contributors:	機電工程學系
Keywords:	Micro bead;Assembly
Date:	2008-06
Issue Date:	2012-06-06T01:43:19Z
Publisher:	National Cheng Kung University
Abstract:	This paper presents a high-density assembly technology and design rules of micro-conductive-bead (4-10μm) assembly. The technology uses photoresist as a non-conductive binding adhesive for beads binding. With resolution quality limited only by photolithography, the method can significantly decrease the bonding pad size of up-to-date circuit chips and PCB boards, thus, it can lead to an increased interconnection density and a reduction in cost. Due to the randomized nature of the bead distribution on bonding pads in the process, we also develop a MATLBR based design tool to provide a guideline for the quality control of the assembly process.
Relation:	The 4th Asia Pacific Conference on Transducers and Micro/Nano Technologies, National Cheng Kung University, June 22-25, 2008
Appears in Collections:	[Department of Mechatronics Engineering] Proceedings

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