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題名: | Multi-Step Three Dimensional Micro Assembly for a Flexible Led Display |
作者: | Chiou, Yu-Ruei;Huang, Shih-Ya;Wang, Kerwin |
貢獻者: | 機電工程學系 |
日期: | 2010-01
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上傳時間: | 2012-06-06T01:43:56Z
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出版者: | IEEE |
摘要: | This paper presents a novel multi-step three dimensional microassembly of passive-circuit-mesh, conductive beads, and LED chips to fabricate a flexible, bright, and wide viewing angle display. A novel flexible display architecture is proposed. To deliver this design, we focus our efforts on the multi-batch assembly integration. A 3-by-3 light-emitting diode array with a chip size of 610!m by 610!m by 90!m is successfully prototyped with device fill factor up to 37.97%. It yields a 990!m squared monochromatic pixel. |
關聯: | IEEE Conference on Micro Electro Mechanical Systems (MEMS), Hong Kong, January 24-28, 2010 |
顯示於類別: | [機電工程學系] 會議論文
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