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|Title: ||Multi-Step Three Dimensional Micro Assembly for a Flexible Led Display|
|Authors: ||Chiou, Yu-Ruei;Huang, Shih-Ya;Wang, Kerwin|
|Issue Date: ||2012-06-06T01:43:56Z
|Abstract: ||This paper presents a novel multi-step three dimensional microassembly of passive-circuit-mesh, conductive beads, and LED chips to fabricate a|
flexible, bright, and wide viewing angle display. A novel flexible display architecture is proposed. To deliver this design, we focus our efforts on the multi-batch assembly integration. A 3-by-3 light-emitting diode array with a chip size of 610!m by 610!m by 90!m is successfully prototyped with device fill factor up to 37.97%. It yields a 990!m squared monochromatic pixel.
|Relation: ||IEEE Conference on Micro Electro Mechanical Systems (MEMS), Hong Kong, January 24-28, 2010|
|Appears in Collections:||[機電工程學系] 會議論文|
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