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題名: Electrical Performance of Micro-assembled Beads under Different Temperatures and Loadings
作者: Tzeng, Yen-Lin;Wang, Kerwin
貢獻者: 機電工程學系
關鍵詞: Assembly;Micro-assembly;Micro beads;Vertical conductive channel;UnderfilL
日期: 2012-03
上傳時間: 2012-06-06T01:44:12Z
出版者: IEEE
摘要: Micro-assembly is an efficient tool to build electrical connections with metallic micro-beads. This process uses patterned photoresist AZ1512 as an adhesion for micro-bead arrangement. The assembled beads is immobilized with underfill embedment (ZYMET 2821). This method allows arbitrary geometric pattern designs. All of these processes can be completed below 150�C. This paper characterizes the electrical
performance of these densely-arranged anisotropic conductive tunnels under different temperatures and stresses loading Experiment results suggest that using photoresist to assemble micro conductive beads with underfill immobilization can yield stable performance.
關聯: The 7th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems (NEMS), Kyoto, Japan, March 5-8, 2012
顯示於類別:[機電工程學系] 會議論文

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