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請使用永久網址來引用或連結此文件: http://ir.ncue.edu.tw/ir/handle/987654321/11402

題名: An Adhesion Strength Measurement Method for Particle Transfer and Assembly in Dry Environment
作者: Lin, Yen-Ting;Wang, Shou-Fu;Lin, Yan-Bo;Wang, Kerwin
貢獻者: 機電工程學系
關鍵詞: PDMS;Adhesive strength;Adhesion;Assembly;Jlipchip
日期: 2012-03
上傳時間: 2012-06-06T01:44:17Z
出版者: IEEE
摘要: This research presents a new and noncontact method to measure the adhesion strength between microparticles and substrates in parallel. It is cost effective and time saving. In this study, the adhesion strength between micro solder ball and PDMS (polydimethylsiloxane) and ReproRubber@
(polymethylhylhydrogen) are investigated. The setup is capable of evaluating more than 8 particles separately each run. The experiment results indicated that the adhesion strength is highly dependent on surface conditions, parts geometry and material properties. The testing results also have been applied to successive parts transferring and assembling.
關聯: The 7th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems (NEMS), Kyoto, Japan, March 5-8, 2012
顯示於類別:[機電工程學系] 會議論文

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