English  |  正體中文  |  简体中文  |  Items with full text/Total items : 6507/11669
Visitors : 30784138      Online Users : 587
RC Version 3.2 © Powered By DSPACE, MIT. Enhanced by NTU Library IR team.
Scope Adv. Search

Please use this identifier to cite or link to this item: http://ir.ncue.edu.tw/ir/handle/987654321/11402

Title: An Adhesion Strength Measurement Method for Particle Transfer and Assembly in Dry Environment
Authors: Lin, Yen-Ting;Wang, Shou-Fu;Lin, Yan-Bo;Wang, Kerwin
Contributors: 機電工程學系
Keywords: PDMS;Adhesive strength;Adhesion;Assembly;Jlipchip
Date: 2012-03
Issue Date: 2012-06-06T01:44:17Z
Publisher: IEEE
Abstract: This research presents a new and noncontact method to measure the adhesion strength between microparticles and substrates in parallel. It is cost effective and time saving. In this study, the adhesion strength between micro solder ball and PDMS (polydimethylsiloxane) and ReproRubber@
(polymethylhylhydrogen) are investigated. The setup is capable of evaluating more than 8 particles separately each run. The experiment results indicated that the adhesion strength is highly dependent on surface conditions, parts geometry and material properties. The testing results also have been applied to successive parts transferring and assembling.
Relation: The 7th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems (NEMS), Kyoto, Japan, March 5-8, 2012
Appears in Collections:[機電工程學系] 會議論文

Files in This Item:

File SizeFormat

All items in NCUEIR are protected by copyright, with all rights reserved.


DSpace Software Copyright © 2002-2004  MIT &  Hewlett-Packard  /   Enhanced by   NTU Library IR team Copyright ©   - Feedback