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Please use this identifier to cite or link to this item:
http://ir.ncue.edu.tw/ir/handle/987654321/11402
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| Title: | An Adhesion Strength Measurement Method for Particle Transfer and Assembly in Dry Environment |
| Authors: | Lin, Yen-Ting;Wang, Shou-Fu;Lin, Yan-Bo;Wang, Kerwin |
| Contributors: | 機電工程學系 |
| Keywords: | PDMS;Adhesive strength;Adhesion;Assembly;Jlipchip |
| Date: | 2012-03
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| Issue Date: | 2012-06-06T01:44:17Z
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| Publisher: | IEEE |
| Abstract: | This research presents a new and noncontact method to measure the adhesion strength between microparticles and substrates in parallel. It is cost effective and time saving. In this study, the adhesion strength between micro solder ball and PDMS (polydimethylsiloxane) and ReproRubber@
(polymethylhylhydrogen) are investigated. The setup is capable of evaluating more than 8 particles separately each run. The experiment results indicated that the adhesion strength is highly dependent on surface conditions, parts geometry and material properties. The testing results also have been applied to successive parts transferring and assembling. |
| Relation: | The 7th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems (NEMS), Kyoto, Japan, March 5-8, 2012 |
| Appears in Collections: | [機電工程學系] 會議論文
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