National Changhua University of Education Institutional Repository : Item 987654321/11672

English | 正體中文 | 简体中文 | Items with full text/Total items : 6507/11669
Visitors : 30026390 Online Users : 492

RC Version 3.2 © Powered By DSPACE, MIT. Enhanced by NTU Library IR team.

Scope Adv. Search

Login ‧ Upload ‧ Help ‧ About ‧ Administer

NCUEIR > College of Engineering > Department and Graduate Institute of Electronic Engineering > Periodical Articles > Item 987654321/11672

Please use this identifier to cite or link to this item: http://ir.ncue.edu.tw/ir/handle/987654321/11672

Title:	Wireless Communication in a Flip-Chip Package Using Integrated Antennas on Silicon Substrates
Authors:	Branch, J.;Guo, X.;Gao, L.;Sugavanam, A.;Lin, Jau-Jr;Kenneth, K. O.
Contributors:	電機工程學系
Keywords:	Flip-chip package;Integrated antennas;Wireless interconnection
Date:	2005-02
Issue Date:	2012-06-18T02:37:02Z
Publisher:	Institute of Electrical and Electronics Engineers
Abstract:	An intrachip wireless interconnect using integrated antennas is demonstrated in a flip-chip ball grid array package. The wireless interconnect consists of a transmitter-receiver pair, which is fabricated in a 0.18-μm CMOS process. A 15-GHz signal is generated and broadcasted across the integrated circuit. The signal is picked up by a receiver 4 mm away on the same integrated circuit and frequency divided by eight to produce a 1.875-GHz local clock signal. The interconnection is also demonstrated between a transmitting antenna and a packaged receiver 40 cm away from the transmitting antenna. Demonstration of intrachip wireless interconnects in a package has been considered the ultimate test for this technology.
Relation:	IEEE Electron Device Letters, 26(2): 115-117
Appears in Collections:	[Department and Graduate Institute of Electronic Engineering] Periodical Articles

Files in This Item:

File	Size	Format
index.html	0Kb	HTML	873	View/Open