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题名: A study on the bonding conditions and mechanism for glass-to-glass anodic bonding in field emission display
作者: Yen, Wen-Tsai;Lin, Yi- Cheng
贡献者: 機電工程系
关键词: Anodic bonding;Field emission display;Glass-to-glass;Spacer;Sputtering
日期: 2009-09
上传时间: 2012-07-05T07:10:44Z
出版者: VSP, an imprint of Brill
摘要: Here we have investigated the bonding conditions and mechanism for glass-to-glass anodic bonding in indium-tin-oxide (ITO)-coated glass using an Al/Cr composite thin film as an interlayer prepared by RF magnetron sputtering. The experimental results show that the bond strength increases with increasing the bonding temperature, bonding voltage, and Al film thickness. The optimum experimental parameters in the anodic bonding were found to be an Al film thickness of 300 nm, bonding temperature of 300°C, and bonding voltage of 700 V. Oxygen content within the bonded interphase increases and aluminum content decreases on increasing both the temperature and voltage during the bonding process. According to EDS analysis results, the main bond mechanism is proposed to be due to the following chemical reactions: 4Na+ + 4e- → 4Na, xAl + yO2- → Al x O y + 6e-, x = 2, y = 3.
關聯: Journal of Adhesion Science and Technology, 23(1): 151-162
显示于类别:[機電工程學系] 期刊論文


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