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Title: 壓電致動無閥式微泵浦之設計與製作 (I)
The Design and Fabrication of Valve-Less Micropump with Piezoelectric Actuator(I)
Authors: 林義成
Contributors: 機電工程系
Keywords: 無閥式微泵浦;擴流器;壓電致動器;濕蝕刻;陽極接合
Valve-less micropump;Diffuser;Piezoelectric actuator;Wet etching;Anodic bonding
Date: 2003-07
Issue Date: 2012-07-05T07:21:51Z
Publisher: 行政院國家科學委員會
Abstract: 微泵浦採用無閥式為設計基礎,利用壓電陶瓷片作為致動器。微泵浦製造利用微機電製程,包括HNA 與KOH 濕蝕刻,並以
Pyrex7740 康寧玻璃與矽晶片陽極接合,作為微泵浦流道蓋板,並組裝壓電致動器及出入口流道,完成壓電致動無閥式微泵浦雛形。當壓電致動器電極施加約100Vpp 正弦波電壓,即可趨動流體單方向流動。無閥式微泵浦之進出口並無實際閥門,而由擴流器
取代,擴流器之截面利用濕蝕刻而形成半橢圓,擴流器之擴張角度以ANSYS 求得最適當設計。
The valve-less micropump actuated by piezoelectric plate is designed and fabricated. The micropump fabrication makes use of Micro-Electro-Mechanical manufacturing process, including the HNA and KOH wet etching. The Pyrex 7740 glass plate is covered on the silicon chip surface with etching structure, and both are bonded by anodic bonding method. The actuator and inlet/outlet tube is assembled to pump body so that the
micropump prototype is obtained. The peak-topeak actuating voltage of about 100Vpp can result in net pumping flow because of the directing capability of dynamic passive valve, named diffuser. The diffuser is wet etched with half-elliptic cross sections. The ANSYS FEM software is used to simulate the flow characteristics of diffuser.
Relation: 計畫編號:NSC91-2218-E018-002; 研究期間:2002/08-2003/07
Appears in Collections:[Department of Mechatronics Engineering] NSC Projects

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