Bimodal distributions of time-to-failure (TTF) were often seen in copper via electromigration (EM) tests. The failure mechanism of the stressed samples could be correlated to time-to-failure of EM test. Early-failures were via-related, whereas late-failures were metal-stripe-related. The failure mechanisms will be discussed.
關聯:
2001 International Symposium on VLSI Technology, Systems, and Applications, Proceedings, Hsinchu, April 18-20, 2001: 271-274