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Title: A study of bimodal distributions of time-to-failure of copper via electromigration
Authors: Lai, J. B.;Yang, J. L.;Wang, Y. P.;Chang, Shu-Hsuan;Hwang, R. L.;Huang, Y. S.;Hou, C. S.
Contributors: 工業教育與技術學系
Date: 2001-04
Issue Date: 2012-08-27T09:33:40Z
Publisher: Institute of Electrical and Electronics Engineers
Abstract: Bimodal distributions of time-to-failure (TTF) were often seen in copper via electromigration (EM) tests. The failure mechanism of the stressed samples could be correlated to time-to-failure of EM test. Early-failures were via-related, whereas late-failures were metal-stripe-related. The failure mechanisms will be discussed.
Relation: 2001 International Symposium on VLSI Technology, Systems, and Applications, Proceedings, Hsinchu, April 18-20, 2001: 271-274
Appears in Collections:[Department of Industrial Education and Technology] Proceedings

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