National Changhua University of Education Institutional Repository : Item 987654321/13534
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题名: A study of bimodal distributions of time-to-failure of copper via electromigration
作者: Lai, J. B.;Yang, J. L.;Wang, Y. P.;Chang, Shu-Hsuan;Hwang, R. L.;Huang, Y. S.;Hou, C. S.
贡献者: 工業教育與技術學系
日期: 2001-04
上传时间: 2012-08-27T09:33:40Z
出版者: Institute of Electrical and Electronics Engineers
摘要: Bimodal distributions of time-to-failure (TTF) were often seen in copper via electromigration (EM) tests. The failure mechanism of the stressed samples could be correlated to time-to-failure of EM test. Early-failures were via-related, whereas late-failures were metal-stripe-related. The failure mechanisms will be discussed.
關聯: 2001 International Symposium on VLSI Technology, Systems, and Applications, Proceedings, Hsinchu, April 18-20, 2001: 271-274
显示于类别:[工業教育與技術學系] 會議論文

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