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題名: Simulation and Analysis of Optimization Process Parameters for Multi-Cavity Injection Molding Parts Warpage by Genetic Algorithm Method
作者: Chen, Wen-Jong
貢獻者: 工業教育與技術學系
關鍵詞: Genetic Algorithm (GA);Multi-Cavity Injection Molding;Objective Function
日期: 2011-11
上傳時間: 2012-08-27T10:55:18Z
出版者: Trans Tech Publications Ltd.
摘要: This study presents the warpage analysis for products through the combination of the genetic algorithm (GA) method and finite element method (FEM) in multi-cavity injection molding parts; it simulated and analyzed the warpage through controlling the conditions of various parameters in primary processes - filling, packing, and cooling. After 50 iterations of calculations. These results demonstrate that the maximum warpage of the products was 0.5052 mm for multi-cavity injection molding parts. In comparison with the orthogonal array, the maximum warpage could be reduced by approximately 7.24%. It is shown that the GA method can obtain the optimum process conditions for warpage deformation in multi-cavity injection molding parts.
關聯: Applied Mechanics and Materials, 142(3): 54-57
顯示於類別:[工業教育與技術學系] 期刊論文

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