National Changhua University of Education Institutional Repository : Item 987654321/19089

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NCUEIR > College of Engineering > eedept > Periodical Articles > Item 987654321/19089

Please use this identifier to cite or link to this item: http://ir.ncue.edu.tw/ir/handle/987654321/19089

Title:	High-performance Built-in Self-routing for Through-silicon Vias
Authors:	Huang, Tsung-Chu
Contributors:	電子工程學系
Date:	2012-04
Issue Date:	2014-10-27T08:06:35Z
Publisher:	Institution of Engineering and Technology
Abstract:	In this reported work, a built-in self-routing scheme is developed for exploring the through-silicon via (TSV) redundancy to the extremes. A built-in self-router consists of a built-in self-tester for testing the TSVs, and a priority switching network for selecting from M TSVs to N inter-chip interconnects. A switching cell is developed to sequentially construct the priority switching network for area reduction and synthesis regularity. Although a long latency is needed for the encoding network, the best performance during inter-chip communication can be achieved due to only one switch per tier in normal operations. In a multiple fault model with no more than M-N defected TSVs, the repair rate can be always 100.
Relation:	Electronics Letters, 48(9): 480-482
Appears in Collections:	[eedept] Periodical Articles

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