National Changhua University of Education Institutional Repository : Item 987654321/19089
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题名: High-performance Built-in Self-routing for Through-silicon Vias
作者: Huang, Tsung-Chu
贡献者: 電子工程學系 
日期: 2012-04
上传时间: 2014-10-27T08:06:35Z
出版者: Institution of Engineering and Technology
摘要: In this reported work, a built-in self-routing scheme is developed for exploring the through-silicon via (TSV) redundancy to the extremes. A built-in self-router consists of a built-in self-tester for testing the TSVs, and a priority switching network for selecting from M TSVs to N inter-chip interconnects. A switching cell is developed to sequentially construct the priority switching network for area reduction and synthesis regularity. Although a long latency is needed for the encoding network, the best performance during inter-chip communication can be achieved due to only one switch per tier in normal operations. In a multiple fault model with no more than M-N defected TSVs, the repair rate can be always 100.
關聯: Electronics Letters, 48(9): 480-482
显示于类别:[電子工程學系] 期刊論文

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