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|Title: ||A New Structure for CMOS Thermal-Bubble-Based Accelerometer|
|Authors: ||Chen, Shu-Jung|
|Issue Date: ||2010-11-29T07:09:09Z
|Abstract: ||In this paper, we design andfabrication a novel thermalbubble-based micromachined accelerometer with advantages of minimum solid thermal conductance and high sensitivity successfully. It can detect two-dimension acceleration changed and apply to technology of inclinometers, anemometers andflow meters. A new accelerometer consists of a micro heater and two pairs of thermopiles floating over an etched cavity that is constructed by our proposed micro-link structure. The heater and the thermopiles are connected by network-like structure of micro-links, which enhance the structure and greatly reduce the solid heat flow from the heater to the hot junctions of thermopiles. The samples are fabricated by TSMC 0. 35fum 2P4M CMOSprocess which is provided by CIC with outstanding strong structures and uniform quality. Our design is proved to be adequate for commercial batch production. We measure the output signal by inclining the sensor to evaluate the performance of this accelerometer. The measurement shows the
output signal is inverse proportional to the tilt angel and the output voltage is increased when the input power increases. Furthermore,the sensitivity was obtainedfor acceleration vs. output voltage with an average slope of 0.325uVlg in this case.
|Relation: ||IMTC 2007 - Instrumentation and Measurement Technology Conference, May 1-3, 2007:1-6|
|Appears in Collections:||[機電工程學系] 會議論文|
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