National Changhua University of Education Institutional Repository : Item 987654321/6433

English | 正體中文 | 简体中文 | Items with full text/Total items : 6507/11669
Visitors : 30417024 Online Users : 416

RC Version 3.2 © Powered By DSPACE, MIT. Enhanced by NTU Library IR team.

Scope Adv. Search

Login ‧ Upload ‧ Help ‧ About ‧ Administer

NCUEIR > College of Engineering > Department of Mechatronics Engineering > Proceedings > Item 987654321/6433

Please use this identifier to cite or link to this item: http://ir.ncue.edu.tw/ir/handle/987654321/6433

Title:	A New Structure for CMOS Thermal-Bubble-Based Accelerometer
Authors:	Chen, Shu-Jung Shen, Chih-Hsiung
Contributors:	機電系
Keywords:	Thermopile Accelerometer CMOS MEMS
Date:	2007
Issue Date:	2010-11-29T07:09:09Z
Abstract:	In this paper, we design andfabrication a novel thermalbubble-based micromachined accelerometer with advantages of minimum solid thermal conductance and high sensitivity successfully. It can detect two-dimension acceleration changed and apply to technology of inclinometers, anemometers andflow meters. A new accelerometer consists of a micro heater and two pairs of thermopiles floating over an etched cavity that is constructed by our proposed micro-link structure. The heater and the thermopiles are connected by network-like structure of micro-links, which enhance the structure and greatly reduce the solid heat flow from the heater to the hot junctions of thermopiles. The samples are fabricated by TSMC 0. 35fum 2P4M CMOSprocess which is provided by CIC with outstanding strong structures and uniform quality. Our design is proved to be adequate for commercial batch production. We measure the output signal by inclining the sensor to evaluate the performance of this accelerometer. The measurement shows the output signal is inverse proportional to the tilt angel and the output voltage is increased when the input power increases. Furthermore,the sensitivity was obtainedfor acceleration vs. output voltage with an average slope of 0.325uVlg in this case.
Relation:	IMTC 2007 - Instrumentation and Measurement Technology Conference, May 1-3, 2007:1-6
Appears in Collections:	[Department of Mechatronics Engineering] Proceedings

Files in This Item:

File	Size	Format
index.html	0Kb	HTML	938	View/Open

Loading...