National Changhua University of Education Institutional Repository : Item 987654321/6435
English  |  正體中文  |  简体中文  |  全文笔数/总笔数 : 6507/11669
造访人次 : 30285625      在线人数 : 489
RC Version 3.2 © Powered By DSPACE, MIT. Enhanced by NTU Library IR team.
搜寻范围 进阶搜寻

jsp.display-item.identifier=請使用永久網址來引用或連結此文件: http://ir.ncue.edu.tw/ir/handle/987654321/6435

题名: Researches of a Novel 2D CMOS Thermal Based Accelerometer
作者: Shen, Chih-Hsiung
Chen, Shu-Jung
Yang, Yin-Ting
贡献者: 機電系
关键词: Accelerometer
CMOS
Inclinometer
Micro-Electro-Mechanical Systems (MEMS)
Thermopile
日期: 2007
上传时间: 2010-11-29T07:12:20Z
摘要: Conventionally the accelerometer behaves like a spring – mass system and its structures involve solid proof mass, which is allowed to move under acceleration conditions. In this paper, we design and fabrication a novel thermal-bubble-based micromachined accelerometer with advantages of minimum solid thermal conductance and high sensitivity successfully. The proposed accelerometer based on thermal convection creates a tiny heated air bubble hermetically sealed inside the sensor package cavity. Four thermopiles around the center heater serve as the temperature sensors to detect two-dimension motion of the chip and also are adequately applied to the technology of inclinometers, anemometers and flow meters. A new micro-link structure is also proposed to enhance the construction of accelerometer with the micro heater and two pairs of thermopiles floating over an etched cavity. The heater and the thermopiles are connected by network-like structure of micro-links, which enhance the structure and greatly reduce the solid heat flow from the heater to the hot junctions of thermopiles. The samples are fabricated by TSMC 0.35μm 2P4M CMOS process which is provided by CIC with outstanding strong structures and uniform quality. Our design is proved to be adequate for commercial batch production. We measure the output signal by inclining the sensor to evaluate the performance of this accelerometer.
關聯: International Conference on Advanced Manufacture(ICAM 2007), November 26-28, 2007
显示于类别:[機電工程學系] 會議論文

文件中的档案:

没有与此文件相关的档案.



在NCUEIR中所有的数据项都受到原著作权保护.

 


DSpace Software Copyright © 2002-2004  MIT &  Hewlett-Packard  /   Enhanced by   NTU Library IR team Copyright ©   - 回馈