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Please use this identifier to cite or link to this item: http://ir.ncue.edu.tw/ir/handle/987654321/11368

Title: 立體微組裝技術在軟性電子產品上的發展與應用
The Development of 3D Micro-Assembly Technologies and Their Applications for Flexible Electronics
Authors: 王可文
Contributors: 機電工程學系
Date: 2009-08
Issue Date: 2012-06-06T01:42:11Z
Publisher: 行政院國家科學委員會
Relation: 計畫編號:NSC98-2221-E018-012-MY2; 研究期間:200908-201007
Appears in Collections:[機電工程學系] 國科會計畫

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