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NCUEIR > College of Engineering > Department of Mechatronics Engineering > Proceedings > Item 987654321/11386

Please use this identifier to cite or link to this item: http://ir.ncue.edu.tw/ir/handle/987654321/11386

Title:	Template Based Assembly for Solid State Cooling
Authors:	Wang, Kerwin;Baskaran, Rajashree;Bohringer, Karl F.
Contributors:	機電工程學系
Date:	2007-07
Issue Date:	2012-06-06T01:43:17Z
Abstract:	This paper presents a fully dry assembly method to obtain densely packed arrays of parts from 400-800μm in size. This approach shows promise for enabling formation of a module of n and p type materials optimized for micro scale thermoelectric cooling performance.
Relation:	IPACK2007(ASME InterPACK '07), Vancouver, British Columbia, CANADA, July 8-12, 2007
Appears in Collections:	[Department of Mechatronics Engineering] Proceedings

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