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Please use this identifier to cite or link to this item:
http://ir.ncue.edu.tw/ir/handle/987654321/11672
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| Title: | Wireless Communication in a Flip-Chip Package Using Integrated Antennas on Silicon Substrates |
| Authors: | Branch, J.;Guo, X.;Gao, L.;Sugavanam, A.;Lin, Jau-Jr;Kenneth, K. O. |
| Contributors: | 電機工程學系 |
| Keywords: | Flip-chip package;Integrated antennas;Wireless interconnection |
| Date: | 2005-02
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| Issue Date: | 2012-06-18T02:37:02Z
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| Publisher: | Institute of Electrical and Electronics Engineers |
| Abstract: | An intrachip wireless interconnect using integrated antennas is demonstrated in a flip-chip ball grid array package. The wireless interconnect consists of a transmitter-receiver pair, which is fabricated in a 0.18-μm CMOS process. A 15-GHz signal is generated and broadcasted across the integrated circuit. The signal is picked up by a receiver 4 mm away on the same integrated circuit and frequency divided by eight to produce a 1.875-GHz local clock signal. The interconnection is also demonstrated between a transmitting antenna and a packaged receiver 40 cm away from the transmitting antenna. Demonstration of intrachip wireless interconnects in a package has been considered the ultimate test for this technology. |
| Relation: | IEEE Electron Device Letters, 26(2): 115-117 |
| Appears in Collections: | [電機工程學系] 期刊論文
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