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题名: Wafer Bonding of 50-mm-Diameter Mirror Substrates to AlGaInP Light-Emitting Diode Wafers
作者: Horng, R. H.;Wuu, D. S.;Seieh, C. H.;Peng, W. C.;Huang, Man-Fang;Tsai, S. J.;Liu, J. S.
贡献者: 光電科技研究所
关键词: Wafer bonding;AlGaInP;Mirror substrates;Light-emitting diode (LED)
日期: 2001
上传时间: 2012-08-07T06:17:25Z
出版者: SpringerLink
摘要: The feasibility of bonding 50-mm-diameter Si with a Au/AuBe mirror to AlGaInP
light-emitting diode (LED) wafers is demonstrated. Wafer bonding over the
entire wafer area is achieved while the metallic mirror still maintains high
reflectivity. Using this technique, the mirror-substrate AlGaInP LEDs are
fabricated across an entire 50-mm wafer. The test data show that 98% of the dice
with operating voltages <2.2 V at 20 mA and 85% of the dice with luminous
intensity in the 130~140 mcd region. The wafer-bonded mirror-substrate LED
lamps operating at 626 nm can emit 3 lm at 20 mA with a forward voltage of 2
V, corresponding to a luminous efficiency of 74 lm/W. Moreover, they present a
peak power efficiency of 21% with 4 mW output at 10 mA (1.9 V). Essentially no
degradation is observed for these LEDs after 2000 h stress at 80∞C and 50 mA
(55.6 A/cm2). The results indicate the mirror-substrate AlGaInP LEDs of highly
reliable and efficient performance.
關聯: J. of Electronic Materials, 30(8): 907-910
显示于类别:[光電科技研究所] 期刊論文


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