Loading...
|
Please use this identifier to cite or link to this item:
http://ir.ncue.edu.tw/ir/handle/987654321/11386
|
Title: | Template Based Assembly for Solid State Cooling |
Authors: | Wang, Kerwin;Baskaran, Rajashree;Bohringer, Karl F. |
Contributors: | 機電工程學系 |
Date: | 2007-07
|
Issue Date: | 2012-06-06T01:43:17Z
|
Abstract: | This paper presents a fully dry assembly method to obtain densely packed arrays of parts from 400-800μm in size. This approach shows promise for enabling formation of a module of n and p type materials optimized for micro scale thermoelectric cooling performance. |
Relation: | IPACK2007(ASME InterPACK '07), Vancouver, British Columbia, CANADA, July 8-12, 2007 |
Appears in Collections: | [機電工程學系] 會議論文
|
Files in This Item:
File |
Size | Format | |
index.html | 0Kb | HTML | 499 | View/Open |
|
All items in NCUEIR are protected by copyright, with all rights reserved.
|