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Please use this identifier to cite or link to this item:
http://ir.ncue.edu.tw/ir/handle/987654321/19089
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| Title: | High-performance Built-in Self-routing for Through-silicon Vias |
| Authors: | Huang, Tsung-Chu |
| Contributors: | 電子工程學系 |
| Date: | 2012-04
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| Issue Date: | 2014-10-27T08:06:35Z
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| Publisher: | Institution of Engineering and Technology |
| Abstract: | In this reported work, a built-in self-routing scheme is developed for exploring the through-silicon via (TSV) redundancy to the extremes. A built-in self-router consists of a built-in self-tester for testing the TSVs, and a priority switching network for selecting from M TSVs to N inter-chip interconnects. A switching cell is developed to sequentially construct the priority switching network for area reduction and synthesis regularity. Although a long latency is needed for the encoding network, the best performance during inter-chip communication can be achieved due to only one switch per tier in normal operations. In a multiple fault model with no more than M-N defected TSVs, the repair rate can be always 100. |
| Relation: | Electronics Letters, 48(9): 480-482 |
| Appears in Collections: | [電子工程學系] 期刊論文
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