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Please use this identifier to cite or link to this item: http://ir.ncue.edu.tw/ir/handle/987654321/19089

Title: High-performance Built-in Self-routing for Through-silicon Vias
Authors: Huang, Tsung-Chu
Contributors: 電子工程學系 
Date: 2012-04
Issue Date: 2014-10-27T08:06:35Z
Publisher: Institution of Engineering and Technology
Abstract: In this reported work, a built-in self-routing scheme is developed for exploring the through-silicon via (TSV) redundancy to the extremes. A built-in self-router consists of a built-in self-tester for testing the TSVs, and a priority switching network for selecting from M TSVs to N inter-chip interconnects. A switching cell is developed to sequentially construct the priority switching network for area reduction and synthesis regularity. Although a long latency is needed for the encoding network, the best performance during inter-chip communication can be achieved due to only one switch per tier in normal operations. In a multiple fault model with no more than M-N defected TSVs, the repair rate can be always 100.
Relation: Electronics Letters, 48(9): 480-482
Appears in Collections:[電子工程學系] 期刊論文

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